| Processor |
|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 3.1 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 200 W |
| Processor cache | 24.75 MB |
| Processor ARK ID | 192451 |
| Processor model | 6254 |
| Processor threads | 36 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 18 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Memory |
|---|
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2933 MHz |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics |
|---|
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power |
|---|
| Thermal Design Power (TDP) | 200 W |
| Technical details |
|---|
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 4S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | No |
| Product type | Processor |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 200 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Market segment | Server |
| Launch date | Q2'19 |
| Intel Virtualization Technology (VT-x) | Yes |
| Number of UPI links | 3 |
| Memory speed (max) | 2933 MHz |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Target market | Cloud Computing |
| Servicing status | Baseline Servicing |
| Features |
|---|
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 200 W |
| Processor package size | 76mm x 56.5mm |
| Processor ARK ID | 192451 |
| Execute Disable Bit | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 4S |
| Embedded options available | No |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Export Control Classification Number (ECCN) | 5A992C |
| Commodity Classification Automated Tracking System (CCATS) | G077159 |
| PCI Express CEM revision | 3.0 |
| Processor special features |
|---|
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel Turbo Boost Max Technology 3.0 | No |
| Intel® Speed Shift Technology | Yes |
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Volume Management Device (VMD) | Yes |
| Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | No |
| Intel® Optane™ DC Persistent Memory Supported | Yes |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Mode-based Execute Control (MBE) | Yes |
| Intel® Run Sure Technology | Yes |
| Intel® Resource Director Technology (Intel® RDT) | Yes |
| Intel® vPro™ Platform Eligibility | Yes |
| Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | No |
| Intel® Optane™ DC Persistent Memory technology | Yes |
| Intel Speed Select Technology (SST) | No |
| Intel® Transactional Synchronization Extensions | Yes |
| Operational conditions |
|---|
| Tcase | 82 °C |
| Logistics data |
|---|
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions |
|---|
| Processor package size | 76mm x 56.5mm |
| Other features |
|---|
| Maximum internal memory | 1 TB |
