Lenovo Xeon Intel Gold 5415+ processor 2.9 GHz 22.5 MB Box
£1,855.45
£1,546.21
ThinkSystem SR650 V3 Intel Xeon Gold 5415+ 8C 150W 2.9GHz Processor Option Kit w/o Fan
Processor socket | LGA 4677 (Socket E) |
---|---|
Processor cores | 8 |
Processor family | Intel Xeon Gold |
On-board graphics card | No |
SKU | 4XG7A84163 |
EAN | 0889488663286 |
Manufacturer | Lenovo |
Availability | In Stock |
Product Family | Xeon |
Processor | |
---|---|
Processor generation | Intel Xeon Scalable 4th Gen |
Processor base frequency | 2.9 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Sapphire Rapids |
Thermal Design Power (TDP) | 150 W |
Processor cache | 22.5 MB |
Processor ARK ID | 232373 |
Processor model | 5415+ |
Processor threads | 16 |
System bus rate | 16 GT/s |
Processor boost frequency | 4.1 GHz |
Stepping | S3 |
Processor family | Intel® Xeon® Gold |
Processor cores | 8 |
Processor socket | LGA 4677 (Socket E) |
Package type | Box |
High priority cores | 2 |
High priority core frequency | 3.1 GHz |
Low priority cores | 6 |
Memory | |
Maximum internal memory supported by processor | 6 TB |
Memory types supported by processor | DDR5-SDRAM |
Supported memory types | DDR5-SDRAM |
Memory channels | Octa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 150 W |
Technical details | |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 5.0 |
Supported instruction sets | AMX, SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 150 W |
Supported memory types | DDR5-SDRAM |
Status | Launched |
Market segment | Server |
Launch date | Q1'23 |
Intel Virtualization Technology (VT-x) | Yes |
Number of UPI links | 3 |
Memory speed (max) | 4400 MHz |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Package carrier | E1B |
Features | |
Maximum number of PCI Express lanes | 80 |
Thermal Design Power (TDP) | 150 W |
Processor package size | 77.5 x 56.5 mm |
Processor ARK ID | 232373 |
Execute Disable Bit | Yes |
PCI Express slots version | 5.0 |
Supported instruction sets | AMX, SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Embedded options available | Yes |
Market segment | Server |
Harmonized System (HS) code | 8542310001 |
Export Control Classification Number (ECCN) | 5A992C |
Commodity Classification Automated Tracking System (CCATS) | G180729 |
Use conditions | Server/Enterprise |
Processor special features | |
---|---|
Intel Software Guard Extensions (Intel SGX) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel® Speed Shift Technology | Yes |
Intel® OS Guard | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Intel® Boot Guard | Yes |
Intel® Optane™ DC Persistent Memory Supported | Yes |
Intel® Deep Learning Boost (Intel® DL Boost) on CPU | Yes |
Mode-based Execute Control (MBE) | Yes |
Intel® Run Sure Technology | Yes |
Intel® Resource Director Technology (Intel® RDT) | Yes |
Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | Yes |
Intel® Transactional Synchronization Extensions | Yes |
Intel® Total Memory Encryption | Yes |
Intel® Control-flow Enforcement Technology (CET) | Yes |
Maximum Enclave Size Support for Intel® SGX | 128 GB |
Intel® Platform Firmware Resilience Support | Yes |
Intel® Crypto Acceleration | Yes |
Intel® QuickAssist Software Acceleration | Yes |
Intel® On Demand Feature Activation | Yes |
Intel® QuickAssist Technology (QAT) | 1 default devices |
Intel® Dynamic Load Balancer (DLB) | 1 default devices |
Intel® Data Streaming Accelerator (DSA) | 1 default devices |
Intel® In-memory Analytics Accelerator (IAA) | 1 default devices |
Intel® Advanced Matrix Extensions (AMX) | Yes |
Operational conditions | |
Tcase | 78 °C |
DTS Max | 99 °C |
Packaging data | |
Package type | Box |
Logistics data | |
Harmonized System (HS) code | 8542310001 |
Weight & dimensions | |
Processor package size | 77.5 x 56.5 mm |
Other features | |
Maximum internal memory | 4 TB |
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---|---|---|---|---|---|---|
SKU |
4XG7A84163
|
CD8069504194501
|
CD8069504152900
|
100-000000076
|
100-000000054
|
CD8069504449801
|
Manufacturer |
Lenovo
|
Intel
|
Intel
|
AMD
|
AMD
|
Intel
|
Processor socket |
LGA 4677 (Socket E)
|
LGA 3647 (Socket P)
|
LGA 3647 (Socket P)
|
Socket SP3
|
Socket SP3
|
LGA 3647 (Socket P)
|
Processor family |
Intel Xeon Gold
|
Intel Xeon Gold
|
Intel Xeon W
|
AMD EPYC
|
AMD EPYC
|
Intel Xeon Gold
|
Processor lithography |
N/A
|
up to 22nm
|
up to 22nm
|
up to 22nm
|
up to 22nm
|
up to 22nm
|
Processor cores |
8
|
18
|
16
|
48
|
32
|
16
|
On-board graphics card |
N
|
N
|
N
|
N
|
N
|
N
|
Cooler included |
N
|
N
|
N
|
N
|
N
|
N
|
Discrete graphics card |
N
|
N
|
N
|
N
|
N
|
N
|
Package type |
Box
|
Tray
|
Tray
|
Tray
|
Tray
|
Tray
|